1n4148ws/1n4448ws/1n914bws 200mw high speed smd switching diode small signal diode ? fast switching device(t rr <4.0ns) ? surface device type mounting ? moisture sensitivity level 1 ? matte tin(sn) lead finish with nickel(ni) underplate ? pb free version and rohs compliant ? case : flat lead sod-323f small outline plastic package min max min max 1.15 1.35 0.045 0.053 2.30 2.70 0.091 0.106 0.25 0.40 0.010 0.016 1.60 1.80 0.063 0.071 0.80 1.00 0.031 0.039 0.05 0.20 0.002 0.008 package part no. packing sod-323f 1n4148ws rr 3k / 7" reel sod-323f 1n4448ws rr 3k / 7" reel sod-323f 1n914bws rr 3k / 7" reel sod-323f 1n4148ws rrg 3k / 7" reel sod-323f 1n4448ws rrg 3k / 7" reel sod-323f 1n914bws rrg 3k / 7" reel maximum ratings notes: 1. the suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application. sod-323 maximum ratings and electrical characteristics features mechanical data ? terminal: matte tin plated, solderable per mil-std-202, method 208 guaranteed ? green compound (halogen free) with suffix "g" on packing code and prefix "g" on date code ? high temperature soldering guaranteed: 260 c/10s ma c/w 100 mw v c e value 150 500 ma 300 200 100 v junction and storage temperature range t j , t stg -65 to + 150 mean forward current thermal resistance (junction to ambient) i o r ja v rrm i frm v r power dissipation reverse voltage non-repetitive peak forward current repetitive peak reverse voltage p d type number ? polarity : indicated by cathode band ? weight : 4.850.5 mg rating at 25 c ambient temperature unless otherwise specified. ordering information units symbol s3 s1 s2 s3 marking suggested pad layout s1 s2 unit (inch) pin configuration ? marking code : s1, s2, s3 dimensions f unit (mm) a b c d d a b c e f version : f12
1n4148ws/1n4448ws/1n914bws 200mw high speed smd switching diode small signal diode electrical characteristics i r = i r = 1n4448ws, 1n914bws i f = 1n4148ws i f = 1n4448ws, 1n914bws i f = v r = v r = junction capacitance tape & reel specification carrier depth sprocket hole reel outside diameter reel inner diameter feed hole width sprocke hole position punch hole position sprocke hole pitch embossment center overall tape thickness note 1: a0, b0, and k0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. the component cannot rote more than 10 within the determined cavity. note 2: if b1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. w 8.30 max. reel width w1 14.4 max p0 4.00 0.10 p1 2.00 0.10 0.6 max. 13.0 0.5 e 1.75 0.10 d2 d1 d tape width t 50 min. f 3.50 0.05 item symbol dimension(mm) a 178 1 2.40 max. k min 1.5 0.1 75 - units max ns 4.0 symbol 5.0 - - 100 - 25 - reverse recovery time i f =10ma, i r =60ma, r l =100 ? , i rr =1ma trr pf 4.0 v 100.0ma 0.72 1.0 1.0 - 10.0ma v r =0, f=1.0mhz v c j 0.62 - a - v f i r v (br) na user direction of feed reverse breakdown voltage reverse leakage current type number 100ua 5ua forward voltage 20v 75v 5.0ma top cover tape carieer tape a n y additional label ( if required ) tsc label w1 d1 d2 a version : f12
1n4148ws/1n4448ws/1n914bws 200mw high speed smd switching diode small signal diode rating and characteristic curves fig 1 forward voltage vs forward current 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 0.01 0.1 1 10 100 1000 forward current (ma) forward voltage (v) fig 3 admissible power dissipation curve 0 50 100 150 200 250 0 25 50 75 100 125 150 175 power dissipation (mw) fig 4 typical junction capacitance 0.7 0.7 0.8 0.8 0.9 0.9 1.0 1.0 1.1 1.1 1.2 012345678910 junction capacitance (pf) a mbient temperature (c) reverse voltage (v) 25c fig 2 reverse current vs reverse voltage 0.01 0.1 1 10 100 0 20 40 60 80 100 120 reverse current (ua) reverse voltage (v) ta=25c v r =0v tj=25c f=1mhz 125 version : f12
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